SODER-WICK
from Chemtronics - Desoldering Braid Wick Wire Solder Sucker Flux
Remover
Product
Information
Soder-Wick
Rosin Flux Desoldering Wick 1.5m
Soder-Wick brand
desoldering wick offers the state of the art in desoldering
technology. Soder-Wick is designed for today’s heat sensitive
electronic components using lighter mass, pure copper braid
construction that allows for better thermal conductivity, even at low
temperatures. Soder-Wick responds faster than conventional
desoldering braids thereby minimizing overheating and preventing PCB
damage.
FEATURES
& BENEFITS
-
Non-corrosive
ultra high purity Type R rosin flux
-
Minimizes
the risk of heat damage to the board
-
Will
not leave ionic contamination on the boards
SPECIFICATIONS:
-
MIL-F-14256
F type R flux
-
NASA-STD-8739.3
Soldered Electrical Connections
-
DOD-STD-883E,
Method 2022
-
ANSI/IPC
J STD-004, Type ROL0
Soder-Wick
No Clean Desoldering Wick 1.5m
Soder-Wick No
Clean desoldering wick is designed to provide fast and safe
desoldering without leaving behind harmful flux residues.
Soder-Wick No Clean desoldering wick uses pure, oxygen-free
copper braid and a patented flux technology to make an efficient and
effective desoldering braid.
Soder-Wick brand
desoldering wick offers the state of the art in desoldering
technology. Soder-Wick is designed for today’s heat sensitive
electronic components using lighter mass, pure copper braid
construction that allows for better thermal conductivity, even at low
temperatures. Soder-Wick responds faster than conventional
desoldering braids thereby minimizing overheating and preventing PCB
damage.
FEATURES
& BENEFITS
-
Patented
non-corrosive, halide free, organic no-clean flux
-
Desolders
up to 40% faster than competitive no-clean braids and leaves boards
cleaner
-
Meets
Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation
Resistance
SPECIFICATIONS
-
MIL-F-14256
F
-
NASA-STD-8739.3
Soldered Electrical Connections
-
DOD-STD-883E,
Method 2022
-
ANSI/IPC
J STD-004, Type ROL0
-
Meets
MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
-
Meets
parameters tested by the Singapore Institute of Standards and
Industrial Research (SISIR) for Solderabilit
